School of Engineering and Technology, (SET)

AT81.13 : Failure Analysis of Devices  3(2-3)

With the rapid advancement of IC technology, Failure Analysis(FA) has become a critical element during all the phases of the integrated circuit(IC) product cycle. The goal of failure analysis is to determine the root cause of a failure by physical material analysis as well as electrically oriented defect localization so that corrective action can be taken which in turn can help in quality improvement of the manufacturing product and its yield.

Catalog Description:

Overall View of Failure Analysis of Microelectronic Devices, Imaging Techniques; Surface and Material Analytical Techniques; Other method for Failure Analysis; Statistical design and Analysis of Experiments.



Course Outline:
I.              Overview of Device Fabrication
II.           Overall View of Failure Analysis of Microelectronic Devices
What is Failure Analysis?
Failures in different level-material, wafer, board and assembly, component, contacts and connector, packaging and electrical failures
Techniques used to focus on the root causes of failures
III.         Imaging Techniques (Theory & Applications)
Optical Microscopy
Electron Microscopy
Force Microscopy
Focussed Ion Beam Technique
X-ray imaging
IV.        Surface and Material Analytical Techniques (Theory & Applications)
Auger Electron Spectrscopy
IR spectroscopy
Vibrational spectroscopy
V.           Other method for Failure Analysis
FA techniques using electrical stimulation
ESD Defects and Characterization
Life Time Studies
Failure Analysis using Electrical Test Data
VI.        FA Lab Management
VII.      Failure Analysis & Diagnosis Future: Needs, Challenges
VIII.   Statistical design and Analysis of Experiments
Statistical Tools
Statistical Distributions
Experiments of Evaluation
Experiments of Comparison
Accelerated Experiments
Sequential Experiments
Fatigue Experiments
Laboratory Sessions:
Sample preparation – cutting, lapping and polishing
Defect characterization by Chemical Etching 
Introduction to SEM/TEM
Elemental Analysis by EDAX
Structural Characterization by XRD
Utilization of JUMP software for data analysis
Field Trip

Lecture Notes

Richard J. Ross and Christian Boit:
Microelectronic Failure Analysis Desk Reference 4th Edition, Publisher – ASM International, 1999.
M. Grasserbauer, H. W. Werner:
Analysis of Microelectronic Materials and Devices, Publisher – John Wiley & Sons, Inc, 1995.
ASM Handbook, Volume 10 & 11, Publisher – ASM International
Charles Lipson, Narendra J. Sheth:
Statistical Design and Analysis of Engineering Experiments, Publisher - McGraw Hill Kogakusha, Ltd, 1995.
ISTFA (International Symposium for Testing and Failure Analysis) Proceedings
Electronic Device Failure Analysis Magazine- Manufacturer – ASM
Journal of Electronic Testing: Theory and Applications
Grading System:
The final grade will be computed from the following constituent parts:
Mid-term exam (40%),
Final exam (50%), and
Assignments (10%).
Closed-book examination is used for both mid-term and final exam.