| School of Engineering and Technology, (SET) | ||
| AT79.12 : Characterization Tools in Nanotechnology 3(2-3) | ||
| Course objectives: | ||
The chemical and physical properties of materials are determined by the chemical composition i.e. the kind of atoms, molecules or ions (qualitative composition) and by the relative amount of them (quantitative composition) present in the material. In this course the qualitative and quantitative analysis of materials is discussed. |
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| Learning Outcomes: | ||
Imaging Techniques, Materials Characterization techniques, Surface and Material Analytical Techniques |
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| Pre-requisite(s): | ||
None |
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| Course Outline: | ||
I. Imaging Techniques (Theory & Applications) 1. Optical Microscopy 2. Electron Microscopy 3. Secondary electron scattering, back scattering 4. Scanning Probe Microscopes 5. Focussed Ion Beam Technique 6. X-ray imaging 7. SPM-AFM, STM II. Surface and Material Analytical Techniques (Theory & Applications) 1. Auger Electron Spectrscopy 2. ESCA 3. SIMS 4. Trace elemental analysis with XPS, SIMS, XRF 5. Optical, electronic and vibrational spectroscopic tools 6. X-Ray Diffraction III. Laboratory Sessions: 1. Sample preparation - cutting, lapping and polishing 2. Defect characterization by Chemical Etching 3. Introduction to SEM/TEM 4. Elemental Analysis by EDAX 5. Structural Characterization by XRD 6. Utilization of JUMP software for data analysis 7. Field Trip |
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| Learning Resources: | ||
| Textbook: | ||
Lecture notes |
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| Reference Books: | ||
Eberhart, J. P., Structural and chemical analysis of materials : X-ray, electron and neutron diffraction; X-ray, electron and ion spectrometry; electron microscopy Mak, Thomas C. W., Crystallography in modern chemistry: a resource book of crystal structures Giacovazzo, Carmelo, Fundamentals of crystallography Finniston, H. M., Structural characteristics of materials Richard J. Ross and Christian Boit: Microelectronic Failure Analysis Desk Reference 4th Edition, Publisher - ASM International M. Grasserbauer, H. W. Werner: Analysis of Microelectronic Materials and Devices, Publisher - John Wiley & Sons, Inc. ASM Handbook, Volume 10 & 11, Publisher - ASM International Charles Lipson, Narendra J. Sheth: Statistical Design and Analysis of Engineering Experiments, Publisher - McGraw Hill Kogakusha, Ltd. De Graef, Marc, Introduction to conventional transmission electron microscopy Shindo, Daisuke, Analytical electron microscopy for materials science Williams, David B, Practical analytical electron microscopy in materials science |
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| Journals and Magazines: | ||
ISTFA (International Symposium for Testing and Failure Analysis) Proceedings Electronic Device Failure Analysis Magazine- Manufacturer - ASM Journal of Electronic Testing: Theory and Applications |
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| Evaluation Scheme: | ||
The final grade will be computed from the following constituent parts: mid-term exam (30%), final exam (50%), and assignments (20%). Closed-book examination is used for both mid-term and final exam. |
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| Instructor(s): | ||
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