School of Engineering and Technology, (SET)

This course serves as an introduction to basic processes used in fabricating semiconductor devices and integrated circuits. The objective is to develop the background knowledge necessary to understand the state-of-the-art semiconductor technology related to device fabrication processes.

The students on the completion of this course should be able to:
         Apply knowledge on Microelectronics Fabrication Technology in device fabrication
         Analyze the outcomes of fabrication processes
         Decide and recommend the selection of the semiconductor process technologies

None

I.             Semiconductor Processing Technology
1.      Introduction to Microelectronic Fabrication
2.      Roadmap of Semiconductor Manufacturing
3.      Semiconductor Materials and Process Chemicals
4.      Crystal Growth and Wafer Preparation
5.      Contamination Control

II.          Overview of Wafer Fabrication
1.      Phase Diagrams and Solid Solubility
2.      Basic Wafer Fabrication Operations
3.      Hot Processing and Ion Implantation
4.      Construction of a Semiconductor Circuit
5.      Chip Terminology

III.       Principles of Microelectronics Fabrication
1.      Oxidation
2.      Rapid Thermal Processing
3.      Photolithography

IV.       Photolithographic Processes
1.      Optical Lithography
2.      Photoresists
3.      Nonoptical Lithographic Techniques

V.          Processing of Thin Films
1.      Vacuum Science and Plasmas
2.      Etching
3.      Physical Deposition: Evaporation and Sputtering
4.      Chemical Vapor Deposition
5.      Epitaxial Growth
6.      Device Isolation, Contacts, and Metallization
7.      Fundamentals of Microelectromechanical systems(MEMS)

VI.       Integrated Circuit Manufacturing
1.      Process Yield
2.      Statistical Process Control
3.      Design of Experiment
4.      Computer Integrated Manufacturing

None

1.     S. A. Campbell: The Science and Engineering of Microelectronics Fabrication, Oxford University Press, Second Edition, 2001
1.     S. A. Campbell: Fabrication Engineering at the Micro and Nanoscale, Oxford University press, 2007
2.     R.C. Jaeger: Introduction To Microelectronics Fabrication, 2nd Edition, Pearson, 2001
3.     P. V. Zant: Microchip Fabrication: A Practical Guide to Semiconductor Processing, 3rd Edition, McGraw-Hill Education, 2000
4.     M. J. Madou: Fundamentals of Microfabrication: The Science of Miniaturization, 2nd Edition, CRC Press ,2002
1.     IEEE Circuits and Devices Magazine, IEEE
2.     IEEE Electronics Letters, IEEE     
3.     IEEE Transactions on Circuits and Systems, IEEE

Lectures: 45 hours
Presentations: 3 hours
Assignment: 10 hours
Field Trip: 2 hours
Self-study: 90 hours
The lectures provide the students with the basic understanding of the subject. To increase understanding on the subject and become active learners, the students are required to do field trip, literature review, and presentation. The literature review is the individual assignment. The presentation is a part of the individual assignment for personal development and knowledge sharing.
The final grade will be computed from the following constituent parts: mid-term exam (30%), final exam (50%), and assignments/ project/ field trip report (20%). Open-book examination is used for both mid-term and final exam.

An “A” would be awarded if a student can demonstrate clear understanding of the knowledge learned in class as well as from the laboratory assignments and literature reviews.

A “B” would be awarded if a student can understand the basic principles of the knowledge learned in class, from the laboratory assignments and from literature reviews.

A “C” would be given if a student can understand partially the basic principles of the knowledge learned in class, from the laboratory assignments and from literature reviews.

A “D” would be given if a student shows lack of understanding of the knowledge learned in class, from the laboratory assignments and from literature reviews.
SECTION NAME